PRODUCT | ADLINK
IMB-M43
Form Factor: Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
●Support the 6th/7th Gen Intel® Core™ i7/i5/i3 processor
●Dual-channel DDR4 2133/2400 MHz memory up to 64 GB in four DIMM slots
●PCIe 3.0 slot bifurcation supports up to 5x PCIe 3.0 expansion slots
●Rugged I/O design to enhance I/O port compatibility and reliability
●Total 5 PCIe slots, among 4xPCIe 3.0 x4 lanes plus one 1xPCIe 3.0 x8 lane, 2xPCIe 3.0 x4 lanes plus 2xPCIe 3.0 x8 lanes, or 2xPCIe 3.0 x4 lanes plus 1xPCIe 3.0 x16 lane, and 2x PCI for Motion and I/O cards
PCle-10GPoE
●PCI Express® x4 Compliant Gen 3
●Intel® server-grade X550-AT2 10 Ethernet Controller
●2-port independent 10 Gigabit LAN, up to 10Gbps data rate per port
●Supports NBASE-T technology (2.5 and 5.0 Gbps)
●IEEE 802.3at for PoE+ (Power over Ethernet Plus)
●Compatible with PoE, PoE+ and Non-PoE cameras
●Powered Device (PD) auto detection and classification
●Up to 20W/60W PoE power from PCIe bus/4-pin Molex connector
RK-608B-E
● Supports 10 slot PICMG backplane
● Two 5.25" and two 3.5" external drive bays, one internal 3.5" drive bay
● Upper cover with captive screw
● Drive bay with shock and vibration resistant design
● Replaceable and easy-to-clean air filter
● 12cm cooling fan (85CFM)
● Two USB and one PS/2 keyboard connectors on front panel
NuPRO-E340
● 2nd Gen and 3rd Gen Intel® Core™ i7/i5/i3/Pentium®/Celeron® processor
● Intel® Q67 Express chipset supporting PCI Express 2.0
● Intel® Rapid Storage Technology, supports RAID 0/1/5/10
● 6x COM ports (including 1x RS-232/422/485/485+)
● Supports USB 3.0 with 5 Gb/s data transfer rate
● Supports Serial ATA with 6 Gb/s data transfer rate
MXE-5400i Series
● Full support Intel® IoT Gateway, with pre-loaded Wind River® IDP XT 3.1
● Equipped with 4th Generation Intel® Core™ i7/i5/i3 processor and QM87 chipset
● Certified by Microsoft Azure Cloud Services
● Intel® vPro™ technology for security and manageability (iAMT™ 9.0, TPM 1.2, TXT, Intel® VT™)
● 2x SATA-III (6.0 Gb/s) ports, 2x mPCIe slots (one supporting mSATA SSD)
● DVI-I+2x DisplayPorts, 6x USB 3.0, 4x GbE ports, 8x isolated DI/O
● Rugged design for -20ºC to 60ºC fanless operation (w/ industrial SSD)
● Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent)
MVP-6025
●Fanless expandable embedded computer with Intel Q170 chipset
●Intel Core i7-6700TE Skylake CPU
●2* DDR4-SODIMM RAM slots (up to 32GB total capacity)
●2* PCIe x8 and 2* PCI expansion slots
●1* MiniPCIe with USIM socket
●1* internal SATA III high speed 6Gb/s port
●3* Intel I211AT GbE ports with teaming function
●8* DIO
●2* RS232/422/485 and 2* RS232 ports
●4* USB 3.0 and 2* USB 2.0 (all 1600mA) and 1* internal USB 2.0 ports
●12...24VDC power input
●operating temperature 0...50°C
●wall mount kit included
●Intel Core i7-6700TE Skylake CPU
●2* DDR4-SODIMM RAM slots (up to 32GB total capacity)
●2* PCIe x8 and 2* PCI expansion slots
●1* MiniPCIe with USIM socket
●1* internal SATA III high speed 6Gb/s port
●3* Intel I211AT GbE ports with teaming function
●8* DIO
●2* RS232/422/485 and 2* RS232 ports
●4* USB 3.0 and 2* USB 2.0 (all 1600mA) and 1* internal USB 2.0 ports
●12...24VDC power input
●operating temperature 0...50°C
●wall mount kit included
PCIE-U304
●PCI Express x4 Gen3 Compliant; Host Controller, Fresco FL1100
●Compatible with USB 3.1 Gen 1 (same as USB 3.0)
●4/8 USB Type-A External Interface (PCIe-U304/U308)
●4 additional internal USB 3.0 ports via pin headers (PCIe-U308e only)
●PCIe bus provides up to 18W of USB power; 4-pin Molex connector provides up to 60W of USB power
●The maximum current of each interface is 1500mA
●Multiple cards and multiple cameras can be connected in one system
●Provides an easy-to-use API to implement power on/off control for each interface through software programming